The complex memory manufacturing process involves up to 800 different steps and requires around 300 gases and advanced materials. enScribeTM, a family of advanced etching material, facilitates the manufacturing, while greatly reducing the environmental impact. When a major semiconductor customer adopts one of these molecules as a replacement to the baseline product, it has the potential to reduce the entire sector’s GHG emissions by up to 1%.
CONTRIBUTION TO AVOID 140,000 TONS OF CO2 EMISSIONS IN 2020